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10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

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10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

Name: 10Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process
Brand: Xingqiang
Price: 1 USD

Brand Name : Xingqiang

Model Number : As Per Customer's Model

Place Of Origin : China

Certification : ROHS,ISO,UL,IATF

MOQ : Sample,1 Pc(5 Square Meters)

Price : Gerber Files,BOM List

Packaging Details : Carton Or As Your Request

Delivery Time : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 100000㎡/Month

PCB Type : Custom Multilayer PCB

Min Line Space : 3mil

Bga Pcb : Yes

Minimum Hole Size : 0.1mm

Layer Counts : 1-30L

Copper Overall : 0.5-5oz

Smt Dip Assembly : Support

Board Thickness : 0.2-5.0mm

Legend : White,Black,Yellow,Red

Test : 100% Electrical Test Prior Shipment

Solder Mask Color : Green, Red, Blue, Black, White, Yellow

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XingQiang High-Tg Multi-layer HDI PCB for AI Vision Applications:

XingQiang provides custom PCB services for high-performance AI vision boards like RV1126B. We support multi-layer HDI design, ENIG surface finish, high-Tg FR-4 material, and strict impedance control to ensure stable signal transmission, strong anti-interference, and wide temperature resistance. Ideal for smart security, industrial vision, edge AI computing and IoT devices.

Technical Parameters:

PCB Type	Custom Multilayer PCB
SMT DIP Assembly	Support
Min Line Space	3mil
PCBA Standard	IPC-Class 2
Copper Overall	0.5-5oz
Board Thickness	1.6mm or Tailored
Solder Mask Color	Green, Red, Blue, Black, White, Yellow
Base Material	FR4/FR4 High TG/FR4 Black Core/
Via Type	Through-hole, Blind, Buried, Microvias
Test	100% Electrical Test Prior Shipment
Shipping Method	DHL, UPS, FEDEX Or As Per Your Request

Documentation Checklist for Custom PCB Manufacturing:

• Gerber files (including layers, drill, solder mask, silkscreen)
• PCB BOM list (components, specifications, quantity)
• Pick and place file/XY coordinates for SMT assembly
• Schematic diagram (for DFM review and verification)
• PCB mechanical drawing (outline, dimensions, tolerances)
• Special requirements (impedance control, HDI, blind vias, testing)

10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

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10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

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10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

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10-Layer Custom HDI PCB ENIG Immersion Gold High Density Blind Buried Hole Process

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