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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

Name: FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications
Brand: Xingqiang
Price: 1 USD

Brand Name : Xingqiang

Model Number : As Per Customer's Model

Place Of Origin : China

Certification : ISO 9001 / RoHS /UL / IATF 16949

MOQ : Sample,1 Pc(5 Square Meters)

Price : Based On Gerber Files

Packaging Details : Carton Or As Your Request

Delivery Time : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 100000㎡/Month

PCB Borad Type : FPC PCB Board

Materail : FR-4

Copper Thickness : 0.5-5OZ

Layer : 1-30 Layers

Impedance Control : +/-10% Or +/-5%

Other Item : PCBA/ODM/OEM PCB

Quotation Request : Gerber Files Or BOM List

Panel Thickness : 2.0/1.6/1.2/1.0/0.8/0.6/0.4/0.2Mm

Silkscreen Color : White, Black,Blue,Yellow,Red,Green

Packing : Vacuum Packing With Carton Box

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Flexible Printed Circuit Board for Industrial & Consumer Electronics:

This is a 4-layer flexible printed circuit board (FPC) designed for power supply applications. Made of high-performance polyimide (PI) material with ENIG surface finish, it features excellent flexibility, high temperature resistance, and strong anti-interference ability. Lightweight, bendable, and highly reliable, it is widely used in consumer electronics, wearables, industrial control, automotive electronics, and IoT devices to achieve stable power transmission, signal connection, and optimized internal space layout.

Customization PCB Service:

How to start your project?

• Gerber files (including layers, drills, silkscreen, solder mask)
• PCB assembly BOM list with component specifications
• Centroid (Pick and Place) coordinates file
• Mechanical drawing with dimensions and tolerances
• Schematic diagram and special process requirements

Professional FPC Production Process:

• Material preparation: PI base material and copper foil preparation
• Circuit patterning: Exposure, development and etching to form circuits
• Drilling & plating: Via hole drilling and electroplating for conduction
• Surface treatment: ENIG / OSP to improve solderability and anti-oxidation
• Coverlay lamination & solder mask coating for insulation protection
• Punching / cutting: Forming final outline and bending areas
• Electrical testing: Open / short test and performance verification
• Final inspection, packaging and shipment

FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

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FR4 Electronic FPC PCB Board ENIG Surface Treatment For Power Supply Applications

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